“Chiplets”, or standalone die with defined functions in heterogenous processes, can be packaged together to create a disintegrated SoC. To allow maximum flexibility in terms of die placement and heterogeneity, as well as lowest packaging costs, ultra-short-reach (USR) SerDes can be used to connect chiplets in a standard MCM. For such SerDes to be competitive, it needs to have extremely high bandwidth, and be of lowest possible power. In this talk I will introduce such a SerDes family, called “Glasswing,” discuss some of the theory behind its development, and outline today’s and future applications.