Integrated Fan-Out (InFO) advanced packaging technology offers the most competitive size, radiation protection, costs, and performance characteristics. CoWoS style designs can expand to even 10 dies in the future.
In Multi Die analysis for CoWoS kind of chips , user is more interested in system level results at the package and bump interface for power , noise and reliability analysis. Thermal & SSO analysis is also important
Hence its important to create models which represent the current signatures and parasitics of the die and having reduced nodes to fully simulate.