One of the key technologies to enable product scalability, flexibility and fast time-to-market is multi-die integration. This technique imposes significant Power Delivery Network (PDN) verification challenges because of power sharing between various dies via Interposer/Silicon bridge. In this paper, we present the challenges in enabling cross-die power analysis in a 3D-IC environment as well as provide methods and tools which leverage big data processing techniques like elastic compute and MapReduce to optimally model the physical and the electrical interactions between the various dies and the package and then co-relate the results with the silicon measurement.