The "3D-IC" term is roughly used to cover 3D-Packaging, 2.5D/3D Interposer based designs and 3D-Stacked-ICs. Though 3D-IC has benefits in terms of smaller footprint, cost, integration of heterogeneous wafers, faster interface and improved power, it poses a lot of challenges – heat dissipation, design complexity, testing and power delivery. This presentation concentrates on the Analysis of Power Delivery in 3D-ICs. This presentation covers the traditional method (Divide and Conquer) used in 3D-ICs and its disadvantages. It also covers how Redhawk-3D flow provides better accuracy, efficiency and turn-around time for 3D-IC systems.