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Description
The CMOS Image Sensor (CIS) market is one of the fastest growing semiconductor segments, with 10% annual growth. This segment is now served by an emerging IP market offering mixed-signal IP as well as disruptive architectures. This market is also driving innovation in process technology and 3-D packaging. With increased pixel densities, managing power has become essential. This session provides opportunity to learn about CIS IP architectures, the need for advanced sensor process technology, packaging requirements and leading applications.
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